Diskussion:Chip Scale Package
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Susceptibility for mechanical stress
In BGA die attach and bonding act as stress relief. In the CSP the mechanicel stress is directly injected from the balls to the die. In harsh environments (or even automotive) CSP can lead to serious reliability issues. Imho this should be mentioned. (nicht signierter Beitrag von 213.208.158.34 (Diskussion) 10:10, 25. Nov. 2015 (CET))
- it is done... :) thx. --Heimschützenzentrum (?) 20:44, 25. Nov. 2015 (CET)
